1. Actuation energy for acoustic wave sensor is provided by ______ and _____ mechanisms.
2. The X-ray technique enables microstructures with _______ aspect ratios and ______ precision to be fabricated in a variety of materials.
3. Statement 1: Sensitive to x-ray radiation. Statement 2: must have thermal stability upto 140 degree . Which of the statement is true?
4. Major technical issues involved in the application of MEMS in biomedicine are: Statement 1: Compatibility with biological system of patients Statement 2: Controllability, mobility and easy navigation for operations. Which of the following statements are true?
5. Biomedical sensors can analyze biological samples in a ______ and ______ ways.
6. There are ______ levels in electronic system packing hierarchy.
7. One of the unique characteristics of the piezoelectric effect is that it is _______
8. ______ LIGA process is used to create low aspect ratio structures.
9. ________ device integrates one or several lab functions on a single IC.
10. The blade used for wafer dicing in die preparation is made up of _____ material.
11. In micro system packing, device level packing comes in ________.
12. In thermo compression bonding _______ wire and _______ bond surface is used.
13. FEM stands for ______
14. A __________ that keeps the p/n-junction in reverse bias and monitors the current over time
15. Concentration of chemical etchant HNO3 for magnesium material is ________.
16. Which of the following software is FEM based MEMS software.?
17. Etching temperature and etch rate of silicon material is
18. Which of the following statement is correct? Statement 1: Microfluidics requires low volume of samples. Statement 2: Analysis and time response is slow in microfluidics.
19. The rise time of glass and polyester substrate is ______ sec.
20. The alloys such as _________ are used in wire boing.
21. The radiation emitted by IR LED is ______ to the human eye.
22. Photolithography process involves the use of an _____ and _____ to produce desired pattern on a substrate.
23. In deposition process the deposition happens because of ______ and _____ reaction.
24. ______ technique allows to selectively remove significant amount of silicon from a substrate.
