MEMSBy Sudha M / June 12, 2023 Welcome to MEMS Quiz 1. Actuation energy for acoustic wave sensor is provided by ______ and _____ mechanisms. Piezoelectric, Magnetostrictive Piezoresistive, Mechanical Piezoelectric, chemical Chemical, Optical 2. The X-ray technique enables microstructures with _______ aspect ratios and ______ precision to be fabricated in a variety of materials. High, high High, low Low, high Low, low 3. Statement 1: Sensitive to x-ray radiation. Statement 2: must have thermal stability upto 140 degree . Which of the statement is true? True, false True, true False, true False, false 4. Major technical issues involved in the application of MEMS in biomedicine are: Statement 1: Compatibility with biological system of patients Statement 2: Controllability, mobility and easy navigation for operations. Which of the following statements are true? True, True True, False False, True False, False 5. Biomedical sensors can analyze biological samples in a ______ and ______ ways. Quick, Accurate Slow, Accurate Quick, Inaccurate Slow, inaccurate 6. There are ______ levels in electronic system packing hierarchy. One Two Three Four 7. One of the unique characteristics of the piezoelectric effect is that it is _______ Reversible Irreversible Universal application Bulky 8. ______ LIGA process is used to create low aspect ratio structures. X-ray UV Solar RF 9. ________ device integrates one or several lab functions on a single IC. Lab on Chip Sensor Transducer Micro fluidics 10. The blade used for wafer dicing in die preparation is made up of _____ material. Diamond Steel Platinum Aluminum 11. In micro system packing, device level packing comes in ________. Level – 1 Level – 2 Level – 3 Level – 4 12. In thermo compression bonding _______ wire and _______ bond surface is used. Gold, gold Gold, copper Copper, gold Copper, copper 13. FEM stands for ______ Finite element method Force electron microscopy Force effected membrane Finite electron method 14. A __________ that keeps the p/n-junction in reverse bias and monitors the current over time Potentiostat Multimeter Ammeter Voltmeter 15. Concentration of chemical etchant HNO3 for magnesium material is ________. 12 – 15 % 10 – 15 % 5 – 10 % 5 – 15 % 16. Which of the following software is FEM based MEMS software.? ANSYS CATIA CAD AutoCAD 17. Etching temperature and etch rate of silicon material is 38 – 49, very slow 28 – 49, very slow 38 – 49, very high 28 – 49, Very high 18. Which of the following statement is correct? Statement 1: Microfluidics requires low volume of samples. Statement 2: Analysis and time response is slow in microfluidics. True, false False, true True, true False, false 19. The rise time of glass and polyester substrate is ______ sec. 15, 120 15, 12 120, 15 12, 15 20. The alloys such as _________ are used in wire boing. PdAg Au Cu Ag 21. The radiation emitted by IR LED is ______ to the human eye. Visible Invisible Harmful Harmless 22. Photolithography process involves the use of an _____ and _____ to produce desired pattern on a substrate. Optical image, photosensitive film Mirror image, thin film Light, Reflector Sunlight, White paper 23. In deposition process the deposition happens because of ______ and _____ reaction. Chemical, Physical Chemical, mechanical Mechanical, physical Optical, mechanical 24. ______ technique allows to selectively remove significant amount of silicon from a substrate. Bulk micromachining Surface micromachining Layer micromachining Side micromachining Time's up
