1.
Actuation energy for acoustic wave sensor is provided by ______ and _____ mechanisms.
2.
The X-ray technique enables microstructures with _______ aspect ratios and ______ precision to be fabricated in a variety of materials.
3.
Statement 1: Sensitive to x-ray radiation. Statement 2: must have thermal stability upto 140 degree . Which of the statement is true?
4.
Major technical issues involved in the application of MEMS in biomedicine are: Statement 1: Compatibility with biological system of patients Statement 2: Controllability, mobility and easy navigation for operations. Which of the following statements are true?
5.
Biomedical sensors can analyze biological samples in a ______ and ______ ways.
6.
There are ______ levels in electronic system packing hierarchy.
7.
One of the unique characteristics of the piezoelectric effect is that it is _______
8.
______ LIGA process is used to create low aspect ratio structures.
9.
________ device integrates one or several lab functions on a single IC.
10.
The blade used for wafer dicing in die preparation is made up of _____ material.
11.
In micro system packing, device level packing comes in ________.
12.
In thermo compression bonding _______ wire and _______ bond surface is used.
13.
FEM stands for ______
14.
A __________ that keeps the p/n-junction in reverse bias and monitors the current over time
15.
Concentration of chemical etchant HNO3 for magnesium material is ________.
16.
Which of the following software is FEM based MEMS software.?
17.
Etching temperature and etch rate of silicon material is
18.
Which of the following statement is correct? Statement 1: Microfluidics requires low volume of samples. Statement 2: Analysis and time response is slow in microfluidics.
19.
The rise time of glass and polyester substrate is ______ sec.
20.
The alloys such as _________ are used in wire boing.
21.
The radiation emitted by IR LED is ______ to the human eye.
22.
Photolithography process involves the use of an _____ and _____ to produce desired pattern on a substrate.
23.
In deposition process the deposition happens because of ______ and _____ reaction.
24.
______ technique allows to selectively remove significant amount of silicon from a substrate.
